Epitaxy silicon on insulator (ESOI)

ABSTRACT

Methods and structures for semiconductor devices with STI regions in SOI substrates is provided. A semiconductor structure comprises an SOI epitaxy island formed over a substrate. The structure further comprises an STI structure surrounding the SOI island. The STI structure comprises a second epitaxial layer on the substrate, and a second dielectric layer on the second epitaxial layer. A semiconductor fabrication method comprises forming a dielectric layer over a substrate and surrounding a device fabrication region in the substrate with an isolation trench extending through the dielectric layer. The method also includes filling the isolation trench with a first epitaxial layer and forming a second epitaxial layer over the device fabrication region and over the first epitaxial layer. Then a portion of the first epitaxial layer is replaced with an isolation dielectric, and then a device such as a transistor is formed second epitaxial layer within the device fabrication region.

This application is a continuation of and claims the benefit of U.S.patent application Ser. No. 12/856,314, now U.S. Pat. No. 8,049,277,filed on Aug. 13, 2010, entitled “Epitaxy Silicon On Insulator (ESOI),”which is a continuation of and claims the benefit of U.S. patentapplication Ser. No. 11/521,667, now U.S. Pat. No. 7,803,690, filed onSep. 15, 2006, entitled “Epitaxy Silicon On Insulator (ESOI),” whichclaims the benefit of U.S. Provisional Application No. 60/816,029, filedon Jun. 23, 2006, “Epitaxy Silicon on Insulator (ESOI);” whichapplications are hereby incorporated herein by reference in theirentireties.

TECHNICAL FIELD

This invention relates generally to semiconductor fabrication and moreparticularly to methods and structures for forming shallow trenchisolation (STI) regions in silicon-on-insulator (SOI) substrates.

BACKGROUND

Conventional silicon-on-insulator (SOI) CMOS devices typically have athin layer of silicon, also known as the active layer, on an insulatorlayer such as a buried oxide (BOX) layer. Active devices, such as MOStransistors (MOSFETs), are formed in active regions within the activelayer. The size and placement of the active regions are defined byisolation regions, such as shallow trench isolation (STI) regions.Active devices in the active regions are isolated from the substrate bythe BOX layer.

Devices formed on SOI substrates exhibit many improved performancecharacteristics over their bulk substrate counterparts. SOI substratesare particularly useful in reducing problems relating to reverse bodyeffects, device latch-up, soft-error rates, and junction capacitance.SOI technology therefore enables higher speed performance, higherpacking density, and reduced power consumption.

Currently, there are several techniques available for the fabrication ofSOI substrates. One technique is known as “separation by implantation ofoxygen” (SIMOX), where oxygen is implanted below the silicon surface andthe substrate is annealed to provide a buried silicon oxide layer with asilicon overlayer. The implantation time can be intensive and costprohibitive. Moreover, the SOI substrate may be exposed to high surfacedamage and contamination. A second technique is known as“bond-and-etch-back” SOI (BESOI), where an oxidized wafer is firstdiffusion-bonded to an unoxidized wafer, and the backside of theoxidized wafer is then grinded, polished, and etched to the desireddevice layer. The BESOI approach may be free from the implant damageinherent in the SIMOX approach. However, a time consuming sequence ofgrinding, polishing, and etching may be required. Another technique isknown as the hydrogen implantation and separation approach, wherehydrogen is implanted into silicon with a thermally grown oxide to formembrittlement of the silicon substrate underneath the oxide layer. Theimplanted wafer may then be bonded with another silicon wafer with anoxide overlayer. The bonded wafer may be cut across the wafer at thepeak location of the hydrogen implant by appropriate annealing. Thesefabrication techniques may not be suitable for fabricatingfully-depleted SOI substrates, since the uniform thickness of thesilicon layer of a SOI substrate may be difficult to achieve.

Advanced CMOS fabrication typically also includes forming isolationregions between different devices. For example, some conventional CMOShybrid orientation methods include fabricating isolation regions, e.g.,shallow trench isolation (STI) regions, before the step of forming anepitaxial silicon layer. This particular fabrication sequence leads toproblems. The differential etch rates among various isolation andsemiconductor materials complicates the manufacturing of such CMOSdevices. Accordingly, conventional CMOS manufacturing methods thatinclude forming STI regions on SOI substrates suffer yield losses frometching of isolation regions.

What are needed then are more robust manufacturing methods and devicestructures to more effectively integrate CMOS isolation structures andSOI hybrid orientation technology.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by preferred embodiments ofthe present invention that provide methods and structures forsemiconductor devices having STI regions in SOI substrates.

In on aspect, the present invention provides for a method of forming asemiconductor device. The method includes forming a dielectric layerover a substrate and patterning the dielectric layer to form a trenchtherein. The method further includes epitaxially growing a firstepitaxial layer in the trench while preventing growth of the firstepitaxial layer on the dielectric layer, and epitaxially growing asecond epitaxial layer on said first epitaxial layer and extending overthe dielectric layer.

In another aspect, the present invention provides for a method offorming a semiconductor device including providing a silicon containingsubstrate and forming a silicon oxide layer on the substrate. Openingsare formed in the silicon oxide layer to expose regions of underlyingsubstrate. A first silicon containing material is epitaxially grown onthe exposed regions of underlying substrate while formation of the firstsilicon containing material on the silicon oxide layer is precluded. Asecond silicon containing material is epitaxially grown on the firstsilicon containing material, the second silicon containing materialsubstantially covering the silicon oxide layer.

Structures resulting from the above described methods are also providedfor in other aspects of the present invention.

The foregoing has outlined rather broadly the features and technicaladvantages of the present invention in order that the detaileddescription of the invention that follows may be better understood.Additional features and advantages of the invention will be describedhereinafter which form the subject of the claims of the invention. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiment disclosed may be readily utilized as a basis formodifying or designing other structures or processes for carrying outthe same purposes of the present invention. It should also be realizedby those skilled in the art that such equivalent constructions do notdepart from the spirit and scope of the invention as set forth in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1 a and 1 b are cross sectional and plan views, respectively, ofSOI and STI regions of an embodiment of the invention;

FIGS. 2 and 3 is are cross sectional views of seeded and selectivelateral overgrowth epitaxy layers;

FIGS. 4 a and 4 b are cross sectional and plan views, respectively, ofSOI and STI regions of an embodiment of the invention; and

FIG. 5 is a cross sectional view of NMOS and PMOS transistors formed onSOI epilayers according to embodiments of the invention.

Corresponding numerals and symbols in different figures generally referto corresponding parts unless otherwise indicated. The figures are drawnto clearly illustrate the relevant aspects of the preferred embodimentsand are not necessarily drawn to scale. To more clearly illustratecertain embodiments, a letter indicating variations of the samestructure, material, or process step may follow a figure number.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the presently preferred embodiments arediscussed in detail below. It should be appreciated, however, that thepresent invention provides many applicable inventive concepts that maybe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

Exemplary structures and methods are provided below for fabricating ametal oxide semiconductor field effect transistor (MOSFET) according toembodiments of the invention. Although the exemplary embodiments aredescribed as a series of steps, it will be appreciated that this is forillustration and not for the purpose of limitation. For example, somesteps may occur in a different order than illustrated yet remain withinthe scope of the invention. In addition, not all illustrated steps maybe required to implement the present invention. Furthermore, thestructures and methods according to embodiments of the invention may beimplemented in association with the fabrication or processing of othersemiconductor structures not illustrated.

FIG. 1 a depicts a cross sectional view of a semiconductor device suchas a MOSFET at an intermediate fabrication stage. A semiconductorsubstrate 110 is preferably a silicon wafer, although the substrate 110may alternatively comprise any one of Ge, SiGe, strained silicon,strained germanium, GaAs, or other semiconductor, or combinationsthereof. A dielectric layer 115 is formed over the substrate.

The dielectric layer 115 preferably comprises silicon oxide, which maybe formed by thermal oxidation at a temperature between about 600° C.and 1100° C. and at a pressure between about 1 torr and 10 torr in anoxidizing ambient. The dielectric layer 115 may also be formed using atechnique such as chemical vapor deposition (CVD). It is preferablybetween about 100 Å and 10,000 Å thick. A plurality of openings 120 isformed through the dielectric layer 115 to the substrate 110. Theopenings 120 may be formed, for example, with a conventional masking andetching process, such as a patterned photoresist step followed with abuffered HF etch. Other dielectrics, such of silicon nitride, siliconoxynitride, doped or undoped polysilicon glass, or so-called high-kdielectrics, or so-called low-k dielectrics are also within thecontemplated scope of the present invention.

Turning now to FIG. 1 b, there is illustrated a plan view of a portionof the structure shown in FIG. 1 a. The openings 120 define isolationtrench regions 125, which are formed after further processing asdescribed below according to embodiments of the invention. Additionally,the spacing between the openings 120 define subsequentsilicon-on-insulator (SOI) island regions 130 as described below. Whilethe trench is illustrated as a simple rectangular structure, one skilledin the art will recognize that the specific size, shape, and placementof the trench or trenches is a matter of design choice. Annular,elliptical, oval, elongated, and complex shapes are within the scope ofthe present invention. Additionally, although only one trench is shownin FIG. 1 b for purposes of illustrated, numerous trenches, which may ormay not be intersecting, will typically be employed in embodiments ofthe invention.

Turning now to FIG. 2, a first epitaxial layer 205 is formed on theportion of the substrate 110 exposed by the openings 120. Preferably,the epitaxial process is a high temperature (preferably above 800 C)process using a silane based precursor gas providing silicon depositionat low pressure. Preferably, HCl or other suitable etchant is introducedduring the deposition process to ensure the epitaxial growth isselective to the exposed silicon areas and does not occur on the exposeddielectric areas. Variations to the epitaxial growth process will beapparent to those skilled in the art with routine experimentation. Thefirst epitaxial layer 205 preferably comprises the same material as thesubstrate 110 and has the same crystallographic orientation. It may beformed using any suitable technique, such as LPCVD, PECVD, or ALD, forexample. In an embodiment, the first epitaxial layer 205 may comprisesilicon, germanium, carbon, and combinations thereof. For example, thefirst epitaxial layer 205 may comprise silicon, silicon germanium,silicon carbon, and combinations thereof. The first epitaxial layer 205may also be formed of gallium arsenide.

The epitaxy precursors may include a silicon-containing compound and achlorine-containing ambient, preferably dichlorosilane, SiCl₂H₂, in ahydrogen chloride, HCl, ambient. Such an epitaxy precursor compositionis preferred because it suppresses spurious nucleation at the surface ofthe dielectric layer 115. As shown in FIG. 2, an overfill portion 205 aof the first epitaxial layer 205 preferably overfills the openings 120.

Turning now to FIG. 3, using the overfill 205 a of the first epitaxiallayer 205 as a seed region, or nucleation site region, a secondepitaxial layer 210 is formed on the dielectric layer 115. As notedabove, the preferred epitaxy precursor composition advantageouslysuppresses spurious nucleation on the surface of the dielectric layer115. As such, the growth of the second epitaxial layer 210 proceedslaterally from overfill 205 a of the first epitaxial layer 205 andextends over the surface of the dielectric layer 115. Given that thefirst epitaxial layer 205 provides the seed for the second epitaxiallayer 210, these two layers preferably have the same crystallographicorientation and together form a single, continuous layer. Therefore, oneskilled in the art will understand that describing embodiments as havingtwo separate or physically distinguishable epitaxial layers is for easeof illustration only.

Turning now to FIG. 4 a, the intermediate structure of FIG. 3 isplanarized. A trench 305 (more accurately, a plurality of trenches 305)is anisotropically etched in the first epitaxial layer 205. The trench305 may be formed using a reactive ion etch (RIE) or other dry etch, ananistropic wet etch, or any other suitable anisotropic etch orpatterning process. A trench 305 depth, d1, may be greater than athickness, d2, of the second epitaxial layer 210, i.e., d1>d2 as shownin FIG. 4 a. Preferably, the photomask used for forming trenches 305 isthe same mask that was employed for forming trenches 120. In this waytrenches 305 will be aligned with the edges of dielectric layer 115. Inalternative embodiments, a different photomask could be employed, andtrenches 305 need not extend laterally to the edge of dielectric layer115.

In keeping with preferred embodiments of the invention, the trench 305need not be formed completely through the first epitaxial layer 205 tothe substrate 110. That is, a portion of the first epitaxial layer 205remains buried beneath the trench 305 as shown in FIG. 4 a. As furtherillustrated in FIG. 4 a, trench 305 is filled with isolation dielectric310. The isolation dielectric is shown as substantially completelyfilling trench 305 and being planar with surrounding dielectricepitaxial silicon layer 210. One skilled in the art will recognize thatthis planarity can be obtained in a variety of manners, includingoverfilling trench 305, followed by a chemical mechanical polish (CMP)or etch back step to planarize isolation dielectric 310. Note that thecombination of dielectric layer 115 and 310 completely surround andhence electrically isolate the disparate regions of silicon layer 210.Hence, in this manner, electrically isolated islands are formed whichconstitute the active regions for subsequently formed semiconductordevices and integrated circuits.

A portion of the structure illustrated in FIG. 4 a is shown in plan viewin FIG. 4 b. As shown in FIG. 4 b, the trench 305 and dielectric 310completely surround the SOI island 210. The isolation dielectric 310 maycomprise CVD silicon oxide. It may also comprise a combination ofmaterials, such as CVD silicon oxide, silicon nitride, siliconoxy-nitride, high-k dielectrics, low-k dielectrics, CVD poly-silicon, orother dielectrics. The structure of FIGS. 4 a and 4 b is planarized anddevice fabrication is completed according to conventional methods.

For example, shown in FIG. 5 is an exemplary embodiment wherein an NMOStransistor 405 is formed in a first SOI island region 130 a, and a PMOSdevice 410 is formed in a second island region 130 b by in partimplanting impurities into at least portions of the second epitaxiallayer.

The epitaxial layers 210 may be between about 2 to 200 nm thick andpreferably about 40 nm thick. The epitaxial layers 210 (and thesubstrate) preferably comprise silicon, but it may also comprise SiC,Ge, GaAs, GaAlAs, InP, GaN, or other semiconductor material, or acombination thereof. The dielectric layer 115, which acts as a buriedoxide (BOX) layer, may have a thickness between about 10 to 200 nm,preferably about 50 nm.

NMOS 405 and PMOS 410 device preferably include a gate dielectric suchas silicon oxide having a thickness from about 6 to 100 Å, and morepreferably less than about 20 Å. In other embodiments, the gatedielectric may include a high-k dielectric having a k-valuesubstantially greater than about 7. Possible high-k dielectrics includeTa₂O₅, TiO₂, Al₂O₃, ZrO₂, HfO₂, Y₂O₃, L₂O₃, and their aluminates andsilicates. Other suitable high-k gate dielectrics may include ahafnium-based materials such as HfO₂, HfSiO_(x), HfAlO_(x).

One exemplary combination includes the addition of a stress-inducingfilm to enhance carrier mobility. For example, those skilled in the artknow that it is desirable to induce a tensile strain in the channel ofn-channel transistors in the source to drain region. It is alsodesirable to induce a compressive strain in the channel of p-channeltransistors in the same direction.

When the strain is applied to both PFETs and NFETs with <110> channels,the NFET and PFET channels might be preferably non-parallel to avoidstress induced degradation in either NFET or PFET. It is known thattensile stress is beneficial for NFET, but for PFET, the compressivestress is preferred. Thus, choosing proper crystal orientations in whichone is stress-sensitive and the other is stress-insensitive is a way toresolve this dilemma of strain effect on NFET and PFET.

Strain-inducing STI regions 125 may also be optimized to selectivelyinduce stress in n-channel and p-channel transistors separately. Forexample, a first isolation trench includes a first liner, and a secondisolation trench includes a second liner, or none at all. By way ofexample, a liner may be a nitride layer. The second trench may be linedwith a nitride layer that has been modified, e.g., implanted with ionsor removed. In another example, the first material can be an oxynitride(a nitrided oxide). In this case, the second trench may be lined with anoxide liner or no liner at all, as examples. A liner can then bemodified in some but not all of the plurality of trenches.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations may be made herein without departing from the spirit andscope of the invention as defined by the appended claims. For example,many of the features and functions discussed above may be implementedwith other semiconductor technology. Examples of other technologiescombinable with embodiments include additional devices such as guardrings, scrap lines, seal rings, metal pads, bipolar transistors, ordiodes on substrates of single orientation.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A method comprising: forming a dielectric layerover a substrate, the dielectric layer having an opening exposing thesubstrate; epitaxially growing an epitaxial material through the openingand over the dielectric layer; forming a recess in the epitaxialmaterial, the recess being directly over the opening and extending to adepth below a top surface of the dielectric layer, the depth being atleast to a surface of the substrate; and forming an isolating materialin the recess.
 2. The method of claim 1, wherein the forming the recessincludes etching the epitaxial material.
 3. The method of claim 1,wherein lateral sides of the recess align with lateral sides of theopening.
 4. The method of claim 1, wherein the epitaxially growing theepitaxial material comprises: epitaxially growing a first portion of theepitaxial material through the opening using first process conditions;and epitaxially growing a second portion of the epitaxial material overthe dielectric layer using second process conditions, the first processconditions being different from the second process conditions.
 5. Themethod of claim 4 further comprising planarizing simultaneously thefirst portion of the epitaxial material and the second portion of theepitaxial material.
 6. The method of claim 1, wherein the isolatingmaterial electrically isolates the epitaxial material from thesubstrate.
 7. A method comprising: forming a dielectric layer over asubstrate, the dielectric layer having an opening exposing thesubstrate; epitaxially growing a first epitaxial material through theopening under first process conditions; epitaxially growing a secondepitaxial material from the first epitaxial material and over thedielectric layer, the epitaxially growing the second epitaxial materialbeing under second process conditions different from the first processconditions; forming a recess in the first epitaxial material, the recessbeing directly over the opening and extending to a depth below a topsurface of the dielectric layer; and forming an isolating material inthe recess.
 8. The method of claim 7, wherein the depth is to a bottomsurface of the dielectric layer.
 9. The method of claim 7, wherein therecess has a same width as the opening.
 10. The method of claim 7further comprising planarizing simultaneously the first epitaxialmaterial and the second epitaxial material.
 11. The method of claim 7,wherein the isolating material electrically isolates the secondepitaxial material from the substrate.
 12. The method of claim 7,wherein the first process conditions constrain epitaxial growth in avertical direction, and the second process conditions allow epitaxialgrowth in a lateral direction.
 13. A method comprising: forming a firsttrench in a dielectric layer over a semiconductor substrate; forming asemiconductor layer through the first trench and over the dielectriclayer, the semiconductor layer having a same crystallographicorientation as the semiconductor substrate; forming a second trench inthe semiconductor layer directly over the first trench; and forming anisolating material in the second trench, the isolating materialadjoining a surface of the semiconductor substrate and electricallyisolating the semiconductor layer from the semiconductor substrate. 14.The method of claim 13, wherein the first trench has a first width, andthe second trench has a second width, the second width being equal to orless than the first width.
 15. The method of claim 13, wherein firstlateral sides of the first trench coincide with second lateral sides ofthe second trench.
 16. The method of claim 13, wherein the isolatingmaterial circumscribes the semiconductor layer.
 17. The method of claim13 further comprising forming a stress inducing liner disposed in thesecond trench.
 18. The method of claim 13 further comprising forming adevice disposed in the semiconductor layer.
 19. The method of claim 13,wherein the forming the semiconductor layer comprises: epitaxiallygrowing a first portion of the semiconductor layer through the firsttrench using first process conditions; and epitaxially growing a secondportion of the semiconductor layer over the dielectric layer usingsecond process conditions, the first process conditions being differentfrom the second process conditions.